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The Restriction of Hazardous Substances in Electrical and Electronic Equipment (ROHS) Directive (2002/95/EC)

From 1 July 2006 new electrical and electronic equipment must not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBBs) or polybrominated diphenyl ethers (PBDEs). These must be replaced by other substances. Before 13 February 2005 the European Commission will review the terms of the Directive to take into account any new scientific evidence.

With customer agreement ADD semiconductor can provide Lead Free and therefore ROHS compliant products.

ROHS - The Quest for Lead (Pb) Replacement

ROHS table

ADD Flow Soldering Profile H

ROHS graph

(a) Temp. inc. gradient:   Avg. 1 - 4 °C/sec
(b) Preliminary heating:   Temp. 170 - 190 °C
60sec ~ 180sec
(c) Temp. inc. gradient:   Avg. 1 - 4 °C/sec
(d) Actual heating:   Temp. 260 °C max.
255 °C up 10 sec max.
(d'): Temp. 230 ºC
225 ºC
220 ºC
up 40 sec max. or
up 60 sec max. or
up 80 sec max.
(e) Cooling:   Natural Cooling or
Forced Cooling

* Package Surface Temp.

Summary

  • Heat Resistance
    • H-Rank: 260 ºC x 2 Reflows
    • M-Rank: 250 ºC x 2 Reflows
    • ADD semiconductor recommend Sn-3.0Ag-0.5Cu solder paste. (for Lead-Free)
  • Terminal Materials
    • BGA = Sn-3.0Ag-0.5Cu (Solder Ball)
    • QFP = Sn-2.0Bi (Plating)
  • Discrimination of products
    • Part number ends with-"E1", Device Marked, Label with lead-free logo

The target is to make all ADD semiconductor Devices available lead free.

Customers can contact either their local ADD Sales Office or a ADD Franchised Distributor if they wish to know the Mounting Rank for the devices they use.